Way back in January, at the Consumer Electronics Show (CES), numbers of new UHD models were released by several manufacturers.
The first commercial HEVC chip was announced by Broadcom at the CES, which according to the company, will go into volume production in the middle of 2014. This has marked the transition of HD TVs from such a classy novelty to becoming a universal product and then of a sudden, they seem to be following the path towards obsolescence.
The MIT researcher’s HEVC chip design was worked on by the Taiwan Semiconductor Manufacturing Company via its University Shuttle Program, while the development of the chips was funded by Texas Instruments (TI). The MIT HEVC chip however is not designed for commercial release. But the developers are confident that their design principles would be illustrated by the challenge of implementing HEVC algorithms in silicon, which could be extensively important.